Method of manufacturing light emitting element
AssigneeNichia Corporation
InventorsShuichi IWAMOTO, Shohei SADAMOTO, Shinya MITSUHASHI
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Abstract
The method of manufacturing a light emitting element includes: temporarily fixing a semiconductor layer of a wafer including a base member and the semiconductor layer to a support base member by a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature; forming a cleavage starting portion for dividing the wafer into a plurality of light emitting elements at an ordinary temperature in the wafer; and singulating the wafer into a plurality of light emitting elements on the support base member while the double-sided tape is heated.
Claims20
A method of manufacturing a light emitting element, the method comprising:
- temporarily fixing a semiconductor layer of a wafer including a base member and the semiconductor layer to a support base member by a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature;
- forming a cleavage starting portion for dividing the wafer into a plurality of light emitting elements at an ordinary temperature in the wafer;
- and
- singulating the wafer into a plurality of light emitting elements on the support base member while the double-sided tape is heated.
Dependencies are inferred from the claim text.