Metal Gates of Transistors Having Reduced Resistivity
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Ching Tsai, Yi-Wei Chiu, Li-Te Hsu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Ching Tsai, Yi-Wei Chiu, Li-Te Hsu
Estimating the term…
A method includes forming a transistor, which includes forming a gate dielectric on a semiconductor region, forming a gate electrode over the gate dielectric, and forming a source/drain region extending into the semiconductor region. The method further includes forming a source/drain contact plug over and electrically coupling to the source/drain region, and forming a gate contact plug over and in contact with the gate electrode. At least one of the forming the gate electrode, the forming the source/drain contact plug, and the forming the gate contact plug includes forming a metal nitride barrier layer, and depositing a metal-containing layer over and in contact with the metal nitride barrier layer. The metal-containing layer includes at least one of a cobalt layer and a metal silicide layer.
An integrated circuit device comprising:
An integrated circuit device comprising:
An integrated circuit device comprising:
Dependencies are inferred from the claim text.