Film for component manufacture and component manufacturing method
AssigneeMitsui Chemicals Tohcello, Inc.
InventorEiji HAYASHISHITA
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Abstract
Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.
Claims18
A film for manufacturing semiconductor component which is used in a method for manufacturing a semiconductor component, the film comprising:
- a base layer;
- and an adhesive layer provided on one surface side of the base layer,
- wherein the arithmetic average roughness (Ra) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 μm or more and 2.0 μm or less and the maximum height (Rz) is 1.0 μm or more and 15 μm or less.
A method for manufacturing a semiconductor component comprising:
- a segmenting step of separating a semiconductor wafer into segments in a state in which an adhesive layer of a film for manufacturing semiconductor component is bonded to a back surface of the semiconductor wafer having circuits formed thereon to obtain semiconductor components;
- a pickup step of separating the semiconductor components from the adhesive layer;
- and
- an evaluation step of evaluating the semiconductor wafer or the semiconductor components in a temperature region of 25° C. or lower, or 75° C. or higher prior to the pickup step,
- wherein the arithmetic average roughness (Ra) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 μm or more and 2.0 μm or less and the maximum height (Rz) is 1.0 μm or more and 15 μm or less.
A film for electronic component manufacture used in a method for manufacturing an electronic component, the film comprising:
- a base layer, and an adhesive layer provided on one surface side of the base layer,
- wherein the arithmetic average roughness (Ra) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 μm or more and 2.0 μm or less, and the maximum height (Rz) is 1.0 μm or more and 15 μm or less.
A method for manufacturing an electronic component comprising:
- a segmenting step of separating an array-shaped electronic component, in which semiconductor components are sealed in an array configuration, into segments in a state in which an adhesive layer of a film for electronic component manufacture is bonded to a back surface of the array-shaped electronic component to obtain electronic components;
- a pickup step of separating the electronic component from the adhesive layer;
- and
- an evaluation step of evaluating the array-shaped electronic component or the electronic components in a temperature region of 25° C. or lower, or 75° C. or higher prior to the pickup step,
- wherein the film for electronic component manufacture has a base layer and an adhesive layer provided on one surface side of the base layer, and
- the arithmetic average roughness (Ra) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 μm or more and 2.0 μm or less and the maximum height (Rz) is 1.0 μm or more and 15 μm or less.
Dependencies are inferred from the claim text.