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AssigneeHewlett Packard Enterprise Development LP
InventorsErnesto Ferrer Medina, Niru Kumari, Chih C. Shih, Sergio Escobar-Vargas
Estimating the term…
In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.
A multiple chip module (MCM) comprising:
A vapor chamber system for cooling heat generating components of a circuit board, the system comprising:
An electronic device comprising:
The electronic device of claim 14, further comprising:
Dependencies are inferred from the claim text.