Printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorsSUNG OH CHO, YOON TAI KIM
Life of this patent
Estimating the term…
Abstract
A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
Claims20
A printed circuit board comprising:
- an insulating layer;
- a first pad disposed on a first surface of the insulating layer;
- a first conductive layer disposed on the first pad and including gold (Au);
- a second pad disposed on a second surface of the insulating layer;
- and
- a second conductive layer disposed on the second pad and including gold (Au),
- wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
A printed circuit board comprising:
- an insulating layer;
- a pad disposed on the insulating layer;
- and
- a conductive layer disposed on the pad,
- wherein the conductive layer includes:
- a first region in direct contact with an upper surface of the pad;
- a second region extending from the first region and in direct contact with a side surface of the pad;
- and
- a third region extending from the second region and spaced apart from the pad.
Dependencies are inferred from the claim text.