Control method of dry etching apparatus
AssigneeVault Creation Co., Ltd.
InventorsSang Jun CHOI, Ji Sung KANG, Kyung Jin LEE
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Abstract
The present invention relates to a control method of a dry etching apparatus which can be applied regardless of materials. The control method of a dry etching apparatus may include: a work piece positioning step of positioning a work piece close to a surface of a cathode unit, facing an anode unit; a bidirectional voltage source applying step of applying a voltage to the cathode unit, the voltage having a polarity alternating between a positive voltage and a negative voltage with time; and an etching step of etching the surface of the work piece using plasma generated by the bidirectional voltage source applied to the cathode unit.
Claims8
A control method of a dry etching apparatus, comprising:
- a work piece positioning step of positioning a work piece close to a bottom surface of a cathode unit, facing an anode unit;
- a bidirectional voltage source applying step of applying a voltage to the cathode unit, the voltage having a polarity that alternates between a positive voltage and a negative voltage with time;
- and
- an etching step of etching the surface of the work piece using plasma generated by the bidirectional voltage source applied to the cathode unit.
Dependencies are inferred from the claim text.