Object preparation device and particle beam device with an object preparation device and method for operating the particle beam device

A particle beam apparatus for analyzing and/or for processing an object, having:

• at least one beam generator for generating a particle beam comprising charged primary particles;
• at least one objective lens for focusing the particle beam onto the object, wherein interaction particles and/or interaction radiation arise/arises during an interaction of the particle beam with the object;
• at least one optical axis (OA, OA1, OA2, OA3), along which the particle beam is guidable in the particle beam apparatus;
• at least one detector for detecting the interaction particles and/or the interaction radiation;
• and
• at least one object preparation device, for preparing an object in the particle beam apparatus having:
• at least one cutting device;
• at least one cutting bevel for cutting the object, wherein the cutting bevel is arranged at the cutting device;
• at least one movably embodied object receptacle device having an object receptacle for receiving the object;
• and
• at least one drive unit for moving the object receptacle device from a first position of the object receptacle device into a second position of the object receptacle device, wherein
• the first position of the object receptacle device is an initial position,
• the second position of the object receptacle device is an analysis and/or processing position of the object receptacle device,
• an observation axis (OA) extends through the object receptacle when the object receptacle device is arranged at the second position,
• the observation axis (OA) is aligned parallel to a receptacle axis at least touching the object receptacle device when the object receptacle device is arranged at the first position,
• the observation axis (OA) is arranged on a first side of the cutting bevel, wherein the first side is arranged in a first direction,
• the receptacle axis is arranged on a second side of the cutting bevel, wherein the second side is arranged in a second direction and wherein the first direction and the second direction are diametric,
• the cutting bevel is spaced apart from the observation axis (OA) by a first distance (A1), wherein the first distance (A1) is provided by the stretch between the cutting bevel and the observation axis (OA) perpendicular to the observation axis,
• the cutting bevel is directed in the direction of the object receptacle of the object receptacle device when the object receptacle device is arranged at the first position,
• the object receptacle device arranged at the first position is spaced apart from the observation axis (OA) by a second distance (A2), wherein the second distance (A2) is provided by a stretch between the observation axis (OA) and the receptacle axis perpendicular to the observation axis, and the first distance (A1) is smaller than the second distance (A2),
• wherein the observation axis (OA) of the object preparation device corresponds to the optical axis (OA, OA1, OA2, OA3) of the particle beam apparatus.

A method for operating a particle beam apparatus for analyzing and/or for processing an object, having at least one beam generator for generating a particle beam comprising charged primary particles, at least one objective lens for focusing the particle beam onto the object, wherein interaction particles and/or interaction radiation arise/arises during an interaction of the particle beam with the object, at least one optical axis (OA, OA1, OA2, OA3), along which the particle beam is guidable in the particle beam apparatus, at least one detector for detecting the interaction particles and/or the interaction radiation, and at least one object preparation device, for preparing an object in the particle beam apparatus having at least one cutting device, at least one cutting bevel for cutting the object, wherein the cutting bevel is arranged at the cutting device, at least one movably embodied object receptacle device having an object receptacle for receiving the object, and at least one drive unit for moving the object receptacle device from a first position of the object receptacle device into a second position of the object receptacle device, wherein the first position of the object receptacle device is an initial position, the second position of the object receptacle device is an analysis and/or processing position of the object receptacle device, an observation axis (OA) extends through the object receptacle when the object receptacle device is arranged at the second position, the observation axis (OA) is aligned parallel to a receptacle axis at least touching the object receptacle device when the object receptacle device is arranged at the first position, the observation axis (OA) is arranged on a first side of the cutting bevel, wherein the first side is arranged in a first direction, the receptacle axis is arranged on a second side of the cutting bevel, wherein the second side is arranged in a second direction and wherein the first direction and the second direction are diametric, the cutting bevel is spaced apart from the observation axis (OA) by a first distance (A1), wherein the first distance (A1) is provided by the stretch between the cutting bevel and the observation axis (OA) perpendicular to the observation axis, the cutting bevel is directed in the direction of the object receptacle of the object receptacle device when the object receptacle device is arranged at the first position, the object receptacle device arranged at the first position is spaced apart from the observation axis (OA) by a second distance (A2), wherein the second distance (A2) is provided by a stretch between the observation axis (OA) and the receptacle axis perpendicular to the observation axis, and the first distance (A1) is smaller than the second distance (A2), wherein the observation axis (OA) of the object preparation device corresponds to the optical axis (OA, OA1, OA2, OA3) of the particle beam apparatus, the method including the following steps:

• setting a relative distance of the object from the cutting bevel;
• moving the object receptacle device from the first position in the direction of the second position, wherein a layer of the object is removed by the cutting bevel when moving the object receptacle device such that an area of the object is exposed;
• supplying the particle beam to the exposed area;
• detecting the interaction particles and/or the interaction radiation and generating detection signals;
• and
• analyzing the exposed area by means of the detection signals.

A particle beam apparatus for analyzing and/or for processing an object, having:

• a specimen chamber;
• at least one particle-optical column for generating and guiding a particle beam comprising charged primary particles, wherein the particle-optical column defines an optical axis (OA, OA1, OA2, OA3), along which the particle beam is guidable in the particle beam apparatus from a particle beam generator to the specimen chamber;
• at least one detector for detecting interaction particles and/or the interaction radiation of an interaction of the particle beam with the object;
• and
• at least one object preparation device having a cutting device, which has a cutting bevel, and an object receptacle for receiving the object,
• wherein:
• the object receptacle is embodied to be movable in a plane substantially perpendicular to the optical axis (OA, OA1, OA2, OA3) of the particle-optical column;
• and
• the cutting device is aligned in such a way that the cutting bevel of which extends in a plane that is aligned parallel to the plane substantially perpendicular to the optical axis (OA, OA1, OA2, OA3) of the particle-optical column and is arranged at the cutting device at a side distant from the optical axis (OA, OA1, OA2, OA3) of the particle-optical column.

An object preparation device for preparing an object in a particle beam apparatus, having:

• a cutting device that has a cutting bevel;
• an object receptacle for receiving the object, wherein the object receptacle is adjustable along a linear trajectory;
• a first linear actuator and a third linear actuator that are configured to drive the object receptacle along the same linear trajectory;
• and
• a controller that is configured to actuate the third linear actuator for taking a section of the object and, after taking the section, to actuate the first linear actuator for positioning the object along the linear trajectory in an observation position of the particle beam apparatus,
• wherein the movement of the object receptacle for taking the section and the positioning of the object at the observation position are carried out without reversing the direction along the linear trajectory.