Multilayer electronic component and board having the same

A multilayer electronic component comprising:

• a capacitor body having first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, and including an active region including first and second internal electrodes disposed to be alternately exposed through the third and fourth surfaces, respectively, with respective dielectric layers interposed therebetween and upper and lower cover regions disposed on upper and lower surfaces of the active region, respectively;
• first and second external electrodes including, respectively, first and second connected portions disposed on the third and fourth surfaces of the capacitor body, respectively, and connected to the first and second internal electrodes, respectively, and first and second band portions extending from the first and second connected portions to portions of the first surface;
• and
• first and second bump terminals disposed on the first and second band portions, respectively,
• wherein the first and second bump terminals are spaced apart from the third and fourth surfaces of the capacitor body, respectively, and
• wherein BW/3≤G≤BW and T/5<ET<T/2, where BW is a width of each of the first and second band portions, T is a thickness of each of the first and second connected portions extending along the third and fourth surfaces, respectively, G is a width of each of the first and second bump terminals, and ET is a thickness of each of the first and second bump terminals.