Back to results
US 2019/0103208 A1Published application
Coil component and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorHye Won JUNG
Life of this patent
Estimating the term…
Abstract
A coil component includes a body including a plurality of pattern layers and a via electrode layer connecting the respective conductive pattern layers to each other, and external electrodes disposed on an external surface of the body. A cross-sectional shape of the via electrode layer is divided into an upper region and a lower region, a side surface of the upper region has a tapered shape, and a lower surface of the lower region includes a curved portion.
Claims21
A coil component comprising:
- a body having a multilayer structure in which a plurality of pattern layers are stacked;
- and
- external electrodes disposed on an external surface of the body;
- wherein each of the plurality of pattern layers includes a conductive pattern, a via electrode connected to the conductive pattern, and an insulating material surrounding the conductive pattern and the via electrode,
- the via electrode includes an upper region in a position higher than that of the conductive pattern in the same pattern layer and a lower region in contact with the conductive pattern, and
- a lower surface of the lower region includes a curved portion.
3 more elements
A method for manufacturing a coil component, comprising steps of:
- forming a plurality of pattern layers, and
- preparing a laminate by stacking and pressing the plurality of pattern layers,
- wherein the step of forming the plurality of pattern layers includes:
- preparing a substrate;
- forming a conductive pattern on the substrate;
- laminating an insulating material to seal the conductive pattern;
- laminating an insulating film on the insulating material;
- forming a through hole in the insulating film by exposing and developing a portion of the insulating film;
- forming a via hole penetrating the insulating material in a position corresponding to the through hole and etching a portion of the conductive pattern;
- peeling the insulating film;
- forming a via electrode by filling an inner portion of the via hole with a conductive material;
- laminating a mask on the insulating material;
- removing the substrate;
- and
- removing the mask.
12 more elements
A method for manufacturing a coil component, comprising steps of:
- forming a plurality of pattern layers;
- and
- preparing a laminate by stacking and pressing the plurality of pattern layers;
- wherein the step of forming the plurality of pattern layers includes:
- forming a conductive pattern on an upper surface of a substrate;
- laminating an insulating material on the substrate to enclose the conductive pattern;
- laminating an insulating film on the insulating material;
- forming a through hole in the insulating film to expose the insulating material;
- forming a via hole that penetrates the insulating material and a portion of the conductive pattern;
- and
- forming a via electrode in the via hole,
- wherein a lower surface of the via electrode includes a curved portion.
9 more elements
Dependencies are inferred from the claim text.