Method for manufacturing anisotropic conductive film, and anisotropic conductive film

An anisotropic conductive film comprising:

• an insulating binder formed in a film shape;
• and
• a plurality of conductive particles disposed in a plan view on the insulating binder, wherein
• in a particle diameter distribution graph (X-axis:
• particle diameter (μm), Y-axis:
• number of particles) of the conductive particles, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

A method for manufacturing a connection structure, the method comprising:

• a disposing step of disposing a first electronic component and a second electronic component with an anisotropic conductive film interposed the first electronic component and the second electronic component, the anisotropic conductive film including:
• an insulating binder formed in a film shape, and a plurality of conductive particles disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis:
• particle diameter (μm), Y-axis:
• number of particles) of the conductive particles, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter;
• and
• a curing step of compression bonding the second electronic component to the first electronic component through a compression bonding tool, and curing the anisotropic conductive film.

A connection structure comprising:

• a first electronic component, a second electronic component, and an adhesive film to which the first electronic component and the second electronic component are adhered;
• wherein
• the adhesive film is obtained by curing an anisotropic conductive film including:
• an insulating binder formed in a film shape;
• and a plurality of conductive particles disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis:
• particle diameter (μm), Y-axis:
• number of particles) of the conductive particles, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

A filler disposition film comprising:

• an insulating binder formed in a film shape;
• and
• a plurality of fillers disposed in a plan view on the insulating binder, wherein
• in a particle diameter distribution graph (X-axis:
• particle diameter (μm), Y-axis:
• number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

A connection structure comprising:

• a first component, a second component, and a filler disposition film to which the first component and the second component are adhered;
• wherein
• the filler disposition film including:
• an insulating binder formed in a film shape;
• and a plurality of fillers disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis:
• particle diameter (μm), Y-axis:
• number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.