Fine silver particle dispersion
AssigneeE. I. Du Pont de Nemours and Company
InventorsDave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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AssigneeE. I. Du Pont de Nemours and Company
InventorsDave Hui, Michael Stephen Wolfe, Howard David Glicksman, Haixin Yang, Takashi Hinotsu, Shingo Teragawa
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This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.
A method of manufacturing an electrically conductive thick film comprising steps of:
A conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprises:
A conductive paste comprising a fine silver particle dispersion and an additional silver powder, wherein the fine silver particle dispersion comprises:
Dependencies are inferred from the claim text.