Connected sensor substrate for blister packs

A blister pack for dispensing medication, the blister pack comprising:

• a substantially flat backing;
• a controller;
• a plurality of blisters formed on the backing, wherein the blisters and the backing form cavities for containing the medication, and wherein each of the blisters is generally defined by two opposed long edges and two opposed short edges;
• a plurality of breakable resistive traces applied to the backing, wherein for each blister, one or more of the resistive traces are applied to the backing under the blister to form a subcircuit and wherein the one or more of the resistive traces cross each of the long edges and each of the short edges at least once;
• and
• a plurality of conductive traces applied to the backing for connecting the subcircuits to the controller;
• wherein the controller is adapted to detect breakage of the resistive traces under the blisters by measuring the voltage across the subcircuits.

A blister pack for dispensing medication, the blister pack comprising:

• a substantially flat backing;
• a controller;
• a plurality of blisters formed on the backing, wherein the blisters and the backing form cavities for containing the medication;
• a plurality of breakable resistive traces applied to the backing, wherein for each blister, at least two of the resistive traces are applied to the backing under the blister to form a subcircuit and wherein the resistive traces in the subcircuit are connected in parallel;
• a plurality of conductive traces applied to the backing for connecting the subcircuits to the controller;
• wherein the controller is adapted to detect breakage of the resistive traces under the blisters by measuring the voltage across the subcircuits.