Method of manufacturing a smartcard
AssigneeZwipe AS
InventorsDevin SNELL, Jose Ignacio Wintergerst LAVIN
Life of this patent
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Abstract
A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.
Claims24
A smartcard comprising:
- a card body enclosing a flexible circuit, wherein conductive extension members extend away from the flexible circuit, and wherein a material forming the extension members has a melting temperature higher than the melting temperature of a material forming the card body;
- a cavity formed in the card body and exposing the extension members;
- and
- a contact pad received in the cavity and connected to the extension members by an electrical connection, wherein the electrical connection was formed at a temperature below the melting temperature of the material forming the card body.
A method of manufacturing a smartcard comprising:
- providing a card body enclosing a flexible circuit, wherein conductive extension members extend away from the flexible circuit, wherein a material forming the extension members has a melting temperature higher than the melting temperature of a material forming the card body, and wherein a cavity is formed in the card body exposing the extension members;
- inserting a contact pad into the cavity;
- and
- electrically connecting the contact pad to the extension members using at a temperature below the melting temperature of the material forming the card body.
Dependencies are inferred from the claim text.