Semiconductor package via stack checking
AssigneeInternational Business Machines Corporation
InventorsAnson J. Call, Paul R. Walling
Life of this patent
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Abstract
Embodiments of the invention include methods, systems, and computer program products for checking semiconductor package via proximity rules. Aspects of the invention include receiving, by a processor, the via proximity rules and a semiconductor package design including one or more package layers and a plurality of vias. Each via is mapped to a cell in a three-dimensional array and a via stack including each via is identified. The via stacks are checked against the via proximity rules. A list of via stacks which did not satisfy the via proximity rules is displayed on a user interface.
Claims20
A computer-implemented method for checking semiconductor package via proximity rules, the method comprising:
- receiving, by a processor, the via proximity rules and a semiconductor package design comprising one or more package layers and a plurality of vias;
- mapping each via to a cell in a three-dimensional array;
- identifying, for each via in the three-dimensional array, a via stack comprising the via;
- determining whether each identified via stack satisfies the via proximity rules;
- and
- displaying on a user interface a list of via stacks that do not satisfy the via proximity rules.
A system for checking semiconductor package via proximity rules, the system having a processor coupled to a memory, the processor configured to:
- receive the via proximity rules and a semiconductor package design comprising one or more package layers and a plurality of vias;
- map each via to a cell in a three-dimensional array;
- identify, for each via in the three-dimensional array, a via stack comprising the via;
- determine whether each identified via stack satisfies the via proximity rules;
- and
- display on a user interface a list of via stacks that do not satisfy the via proximity rules.
A computer program product for checking semiconductor package via proximity rules, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processor to cause the processor to perform:
- receiving the via proximity rules and a semiconductor package design comprising one or more package layers and a plurality of vias;
- mapping each via to a cell in a three-dimensional array;
- identifying, for each via in the three-dimensional array, a via stack comprising the via;
- determining whether each identified via stack satisfies the via proximity rules;
- and
- displaying on a user interface a list of via stacks that do not satisfy the via proximity rules.
Dependencies are inferred from the claim text.