Simulation-Assisted Wafer Rework Determination

One or more non-transitory computer-readable media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising:

• receiving metrology data of photoresist patterns on one or more wafers, the metrology data comprising values of critical dimension data, overlay error data or both, the photoresist patterns being created based on a layout design for a circuit design by a photolithographic processing step during a lithographic process;
• selecting hotspots of interest based on comparing the metrology data with simulated metrology data associated with hotspots, wherein the simulated metrology data and information of the hotspots are generated by performing lithographic simulation on the layout design before the lithographic process and stored in a non-transitory computer-readable medium;
• performing lithography simulation on the hotspots of interest for the one or more wafers using process conditions of the photolithographic processing step to generate simulated hotspot data;
• and
• analyzing the simulated hotspot data to determine whether rework of the one or more wafers or a wafer lot to which the one or more wafers belong is needed.

A system, comprising:

• one or more processors, the one or more processors programmed to perform a method, the method comprising:
• receiving metrology data of photoresist patterns on one or more wafers, the metrology data comprising values of critical dimension data, overlay error data or both, the photoresist patterns being created based on a layout design for a circuit design by a photolithographic processing step during a lithographic process;
• selecting hotspots of interest based on comparing the metrology data with simulated metrology data associated with hotspots, wherein the simulated metrology data and information of the hotspots are generated by performing lithographic simulation on the layout design before the lithographic process and stored in a non-transitory computer-readable medium;
• performing lithography simulation on the hotspots of interest for the one or more wafers using process conditions of the photolithographic processing step to generate simulated hotspot data;
• and
• analyzing the simulated hotspot data to determine whether rework of the one or more wafers or a wafer lot to which the one or more wafers belong is needed.