Communicating data with stacked memory dies

A method, comprising:

• generating, at a memory controller and based at least in part on information received from a host device, a first signal modulated using a first modulation scheme that includes three or more levels;
• generating, at the memory controller, a second signal based at least in part on generating the first signal;
• and
• transmitting the first signal and the second signal concurrently to one or more memory dies of a plurality of memory dies that are coupled with the memory controller based at least in part on generating the second signal.

An apparatus, comprising:

• a first plurality of memory dies, one or more memory dies of the first plurality of memory dies comprising a first through-silicon via (TSV);
• and
• a controller coupled with the first plurality of memory dies, the controller operable to:
• generate, based at least in part on a first signal modulated using a first modulation scheme that includes two levels, a second signal modulated using a second modulation scheme that includes three or more levels;
• and
• transmit the second signal to the one or more memory dies of the first plurality of memory dies.

An apparatus, comprising:

• a memory controller coupled with a host device and a plurality of memory dies, wherein the memory controller is operable to:
• receive, from the host device, a first signal modulated using a first modulation scheme that includes two levels;
• generate, based at least in part on receiving the first signal, a second signal modulated using a second modulation scheme that includes three or more levels;
• and
• transmit the second signal to one or more memory dies of the plurality of memory dies.