Multi-part device enclosure
AssigneeApple Inc.
InventorsMikael M. Silvanto, Simon R. Trivett, Matthew S. Theobald, Dinesh C. Mathew, Simon R. Lancaster-Larocque, Robert Y. Cao, Ari P. Miller, Kevin M. Robinson, Houtan R. Farahani, Francesco Ferretti, John Raff, Robert J. Lockwood, Genie Kim, Karan Bir, Keith J. Hendren, Gurshan Deol, Antonio Clarke, Prabhu Sathyamurthy, William A. Counts
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