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AssigneeToray Industries, Inc.
InventorsToshiyasu HIBINO, Yoshinori MATOBA, Mitsuhito SUWA
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A resin composition including a polysiloxane (A) and a solvent (B), wherein the polysiloxane (A) contains at least one partial structure represented by any of the general formulae (1) to (3), and the relationship between the film thickness X and the film thickness Y, which respectively represent the thickness of a film produced by application of the resin composition and subsequent drying at 100° C. for 3 minutes and the thickness of the film after subsequent heating at 230° C. for 5 minutes, satisfies the following inequation: (X−Y)/x≤0.05. The resin composition exhibits excellent coating properties on rugged surface and has excellent planarization properties even if the resin composition is in a form of thin film. (R1 represents a single bond or a C1-4 alkyl group; R2 represents a C1-4 alkyl group; and R3 represents an organic group.)
A resin composition comprising a polysiloxane (A), wherein the polysiloxane (A) contains at least one partial structure represented by any of the general formulae (1) to (3), and the molar content of styryl groups contained in the polysiloxane (A) is in the range of not less than 40% by mole to not more than 99% by mole relative to 100% by mole of the Si atoms:
(canceled)
A resin composition comprising a polysiloxane (A), wherein the polysiloxane (A) is a polysiloxane that is obtainable by hydrolysis and polycondensation of plural alkoxysilane compounds including those represented by the following general formulae (10) and (11):
Dependencies are inferred from the claim text.