Testing apparatus and testing method

A testing apparatus for testing an integrated circuit package having a plurality of electrical terminals, comprising:

• a base comprising a plurality of first electrical contacts and a plurality of second electrical contacts;
• a socket disposed on the base and comprising a first portion corresponding to the first electrical contacts, a second portion corresponding to the second electrical contacts and a plurality of through holes distributed in the first portion and the second portion, wherein a shortest distance between the first portion and the base is substantially greater than a shortest distance between the second portion and the base, and a profile of an upper surface of the socket is substantially conformal to a profile of a lower surface of the socket;
• a plurality of conductive pins disposed in the through holes respectively and electrically connected to the first electrical contacts and the second electrical contacts, wherein each of the conductive pins protrudes from the upper surface of the socket for forming temporary electrical connections with one of the electrical terminals;
• and
• a plurality of conductive pillars disposed on the first electrical contacts and connected to the first portion, wherein each of the conductive pillars electrically connects one of the conductive pins and one of the first electrical contacts.

A testing method for testing an integrated circuit package having a plurality of electrical terminals, comprising:

• evaluating a profile of the integrated circuit package;
• providing a testing apparatus according to the profile of the integrated circuit package, wherein the testing apparatus comprises a base comprising a plurality of electrical contacts, a socket disposed on the base and comprising a plurality of through holes distributed in the socket, a plurality of conductive pins disposed in the through holes and electrically connected to the electrical contacts, and a plurality of conductive pillars connected between the base and the socket, wherein a profile of the socket is corresponding to the profile of the integrated circuit package;
• and
• disposing the integrated circuit package on the testing apparatus, wherein each of the electrical terminals is in temporary electrical connections with one of the conductive pins.