Method for inspecting semiconductor device structure

A method for inspecting a semiconductor device structure, comprising:

• receiving a chip package comprising a to-be-inspected feature, wherein the chip package has a first surface and a second surface;
• applying a polymer-containing solution over the first surface of the chip package;
• disposing a carrier substrate over the first surface of the chip package such that the polymer-containing solution spreads between the carrier substrate and the chip package;
• irradiating the polymer-containing solution with a light to transform the polymer-containing solution into an adhesive layer bonding the carrier substrate and the chip package;
• partially removing the chip package from the second surface to form an opening extending towards the to-be-inspected feature;
• and
• inspecting the to-be-inspected feature after or during the formation of the opening.

A method for inspecting a semiconductor device structure, comprising:

• receiving a semiconductor device structure comprising a to-be-inspected feature, wherein the semiconductor device structure has a first surface and a second surface;
• identifying a target region of the semiconductor device structure, wherein the to-be-inspected feature is in the target region;
• dispensing one or more droplets of a polymer-containing solution over the target region;
• disposing a transparent substrate over the semiconductor device structure such that the polymer-containing solution spreads between the transparent substrate and the chip package;
• irradiating the polymer-containing solution with an ultraviolet light to cure the polymer-containing solution such that an adhesive layer bonding the transparent substrate and the semiconductor device structure is formed;
• forming an opening extending from the second surface of the semiconductor device structure towards the to-be-inspected feature;
• and
• inspecting the to-be-inspected feature after or during the formation of the opening.