Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget

A biochip comprising:

• a patterned passivating layer and a plurality of first landings on a transparent substrate;
• a plurality of second landings on a second substrate;
• a patterned adhesion layer on the transparent substrate or the second substrate, wherein the patterned adhesion layer bonds the second substrate to the transparent substrate;
• a plurality of through-holes in the transparent substrate or the second substrate;
• and
• wherein there is a single path at least partially within the patterned adhesion layer between a first one of the plurality of through-holes and a second one of the plurality of through-holes different from the first one of the plurality of through-holes.

A biochip comprising:

• a patterned adhesion layer bonding a second substrate to a transparent substrate;
• first landings located on the transparent substrate;
• second landings located on the second substrate;
• a plurality of through-holes in the transparent substrate or the second substrate;
• and
• a single path at least partially within the patterned adhesion layer between a first one of the plurality of through-holes and a second one of the plurality of through-holes different from the first one of the plurality of through-holes.