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US 2019/0101461 A1Published application
Low cost overmolded leadframe force sensor with multiple mounting positions
AssigneeHoneywell International Inc.
InventorsJosh M. Fribley, Lamar Floyd Ricks, Richard Wade, Jim Machir, Richard Alan Davis
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Abstract
A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.
Claims20
A force sensor comprising:
- a leadframe comprising:
- a base having a first major surface and an opposing second major surface, with a base side wall extending between the first major surface and the opposing second major surface;
- a plurality of conductive traces supported by the base;
- a plurality of leads each electrically coupled to one or more of the plurality of conductive traces, each of the plurality of leads having a lead end that is spaced from the base;
- a sense die electrically coupled to two or more of the plurality of conductive traces, the sense die comprising one or more piezoresistive sensing elements for sensing a force applied to the sense die;
- and
- an encapsulant engaging both the base and the sense die for providing structural rigidity to the force sensor, wherein the lead end of at least some of the plurality of leads extends outside of the encapsulant to allow for an electrical coupling of the lead to an external component.
4 more elements
A force sensor comprising:
- a leadframe comprising:
- a base having a first major surface and an opposing second major surface, with a base side wall extending between the first major surface and the opposing second major surface;
- a plurality of leads extending from the base;
- a sense die for sensing an applied force, the sense die comprises a first major surface and an opposing second major surface, with a sense die side wall extending between the first major surface and the opposing second major surface, and wherein the second major surface of the sense die faces the first major surface of the base, and wherein the sense die is mechanically secured relative to the base and electrically coupled to two or more of the plurality of leads;
- and
- an encapsulant extending along at least part of the sense die side wall and around at least a perimeter of the first major surface of the sense die, the encapsulant further extending over at least part of the second major surface of the base.
3 more elements
A method comprising:
- disposing a sense die on a leadframe, wherein the leadframe comprises a plurality of electrically conductive leads, wherein the sense die comprises a first major surface facing away from the leadframe and an opposing second major surface, with a sense die side wall extending between the first major surface and the opposing second major surface of the sense die;
- electrically coupling the sense die to the plurality of electrically conductive leads of the leadframe;
- molding an encapsulant over at least a portion of the leadframe and the sense die, wherein the molded encapsulant extends around a perimeter of the first major surface of the sense die and defines an aperture with aperture side walls that extend down to the first major surface of the sense die to expose the first major surface of the sense die;
- and
- providing a gel in the aperture defined by the molded encapsulant, wherein the gel engages the first major surface of the sense die.
2 more elements
Dependencies are inferred from the claim text.