Non-contact temperature measurement sensor

A sensor package comprising:

• a substrate;
• a thermopile sensor disposed over the substrate;
• a reference thermopile sensor disposed over the substrate;
• a reference temperature sensor disposed over the substrate and adjacent to the thermopile sensor and the reference thermopile sensor;
• a lid assembly disposed over the thermopile sensor, the reference thermopile sensor, and the reference temperature sensor, the lid assembly comprising a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths;
• and
• a thermo-optical shield, at least a portion of which is positioned between the transparent structure and one or more of the thermopile sensor, the reference thermopile sensor, or the reference temperature sensor.

A system comprising:

• a sensor package, the sensor package comprising:
• a substrate;
• a thermopile sensor disposed over the substrate;
• a reference thermopile sensor disposed over the substrate;
• a reference temperature sensor disposed over the substrate and adjacent to the thermopile sensor and the reference thermopile sensor;
• a lid assembly disposed over the thermopile sensor, the reference thermopile sensor, and the reference temperature sensor, the lid assembly comprising a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths;
• and
• a thermo-optical shield, at least a portion of which is positioned between the transparent structure and one or more of the thermopile sensor, the reference thermopile sensor, or the reference temperature sensor;
• and
• application-specific integrated circuitry in electrical communication with the sensor package, the application-specific integrated circuitry configured to generate an electrical signal corresponding to electromagnetic radiation detected by the sensor package.