Lighting device

A lighting device comprising:

• a board including a first region, second region, a third region between the first region and the second region, and a fourth region positioned between the second region and a peripheral edge of the board;
• at least one light-emitting element disposed in the first region of the board;
• a drive element disposed in the second region of the board so as to drive the at least one light-emitting element;
• a heat dissipation member disposed under a lower surface of the board;
• and
• a heat dissipation pad disposed between the board and the heat dissipation member,
• wherein the heat dissipation pad comprises:
• a heat dissipation plate disposed on an upper surface of the heat dissipation member;
• a projecting portion projecting from a central area of an upper surface of the heat dissipation plate so as to support a lower surface of the first region of the board;
• and
• support protrusions disposed on the upper surface of the heat dissipation plate and spaced apart from the projecting portion,
• wherein the first region includes a center of the board and is a central region within a predetermined range about the center of the board, and the second region is a region spaced apart from the first region by a first distance and from the peripheral edge of the board by a second distance, and
• wherein the support protrusions support and contact a lower surface of the fourth region.

A lighting device comprising:

• a board including a first region, second region, a third region between the first region and the second region, and a fourth region positioned between the second region and a peripheral edge of the board;
• at least one light-emitting element disposed in the first region of the board;
• a drive element disposed in the second region of the board so as to drive the at least one light-emitting element;
• a heat dissipation member disposed under a lower surface of the board;
• and
• a heat dissipation pad disposed between the board and the heat dissipation member,
• wherein the heat dissipation pad comprises:
• a heat dissipation plate disposed on an upper surface of the heat dissipation member;
• a projecting portion projecting from a central area of an upper surface of the heat dissipation plate so as to support a lower surface of the first region of the board;
• and
• support protrusions disposed on the upper surface of the heat dissipation plate and spaced apart from the projecting portion,
• wherein the first region includes a center of the board and is a central region within a predetermined range about the center of the board, and the second region is a region spaced apart from the first region by a first distance and from the peripheral edge of the board by a second distance,
• wherein the drive element includes a leg penetrating the second region of the board, and
• wherein the board includes:
• a circuit pattern on a lower surface of the second region;
• and
• a solder portion provided on the lower surface of the second region,
• wherein the solder portion is bonded to the leg of the drive element and the circuit pattern.