Vapor deposition mask, vapor deposition mask production method, and organic semiconductor element production method
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsSUSUMU SAKIO, KATSUHIKO KISHIMOTO, KOSHI NISHIDA, KOZO YANO
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Abstract
A vapor deposition mask (100) includes a resin layer (10) including a plurality of openings (11); a magnetic metal layer (20) located so as to overlap the resin layer, the magnetic metal layer including a mask portion (20a) having such a shape as to expose the plurality of openings and a peripheral portion (20b) located so as to enclose the mask portion; and a frame (30) secured to the peripheral portion of the magnetic metal layer. The resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.
Claims20
A vapor deposition mask, comprising:
- a resin layer including a plurality of openings;
- a magnetic metal layer located so as to overlap the resin layer, the magnetic metal layer including a mask portion having such a shape as to expose the plurality of openings and a peripheral portion located so as to enclose the mask portion;
- and
- a frame secured to the peripheral portion of the magnetic metal layer;
- wherein the resin layer is not joined to the mask portion of the magnetic metal layer but is joined to at least a part of the peripheral portion of the magnetic metal layer.
A method for producing a vapor deposition mask including a resin layer, a magnetic metal layer located so as to overlap the resin layer, and a frame supporting the magnetic metal layer, the method comprising the steps of:
- (A) providing the magnetic metal layer formed of a magnetic metal material;
- (B) securing the frame to a part of the magnetic metal layer;
- and
- (C) joining the resin layer to the magnetic metal layer after the step (B);
- wherein where a region of the magnetic metal layer that does not overlap the frame after the step (B) is referred to as a first region and a region of the magnetic metal layer that overlaps the frame after the step (B) is referred to as a second region, the step (C) is performed such that the resin layer is not joined to the first region of the magnetic metal layer but is joined to at least a part of the second region of the magnetic metal layer.
Dependencies are inferred from the claim text.