Thermal-curable adhesive composition and adhesive sheet
AssigneeTaimide Tech. Inc.
InventorsCHIH-WEI LIN, CHUN-TING LAI
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Abstract
The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.
Claims13
A thermal-curable adhesive composition having a rate of change of adhesion ranging from 80% to 98% and defined by the following equation:
- V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is an adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.
An adhesive sheet, comprising:
- a base film;
- and
- an adhesive layer disposed on the base film and formed by a thermal-curable adhesive composition;
- wherein the thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation:
- V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is an adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.
Dependencies are inferred from the claim text.