Metal Compound Chemically Anchored Colloidal Particles and Methods of Production and Use Thereof
AssigneeVersum Materials US, LLC
InventorsHongjun Zhou, Xiaobo Shi, Jo-Ann Theresa Schwartz
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Abstract
Metal compound chemically anchored colloidal particles wherein the metal compound is in molecular form are disclosed. A facile and fast process to chemically anchor metal compounds uniformly onto colloidal particle surfaces via chemical bonding has been developed. Metal compounds are chemically anchored to the surface of colloidal particles via an organic linking agent. Uniformly distributed metal compounds remain in molecular form after the process. The metal compound chemically anchored colloidal particles can be used as solid catalyst in metal chemical-mechanical planarization process.
Claims17
A method of making metal compound chemically anchored colloidal particles comprising:
- providing a solution comprising colloidal particles;
- providing a soluble metal compound precursor;
- providing an organic linking agent containing a functional group selected from the group consisting of amine, carboxylic acid, and combinations thereof;
- mixing the solution comprising colloidal particles, the organic linking agent and the soluble metal compound precursor;
- and
- forming the metal compound chemically anchored colloidal particles;
- wherein the organic linking agent modifies colloidal particle surfaces and anchors metal compounds onto the colloidal particle surfaces via chemical bonding to form the metal compound anchored colloidal particles;
- and the metal compounds are in molecular form.
A polishing composition comprising:
- 0.01-1.00 wt. % metal compound chemically anchored colloidal particles,
- wherein the metal compounds are uniformly anchored on surfaces of colloidal particles via chemical bonding and are in molecular form;
- 0-10 wt. % abrasive;
- 0.05-10 wt. % oxidizer;
- and
- liquid carrier;
- wherein
- pH of the composition is from about 2.0 to about 12.
Dependencies are inferred from the claim text.