Polyimide-based polymer thick film resistor composition
AssigneeE. I. Du Pont de Nemours and Company
InventorSeigi Suh
Life of this patent
Estimating the term…
Abstract
The invention is directed to a polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, a process for forming the resistor and an electrical device containing a resistor formed using the paste composition The paste composition comprise a functional component, a polyimide, and an organic solvent and can be cured by heating.
Claims9
A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:
- (a) 35-70 wt % of a functional component selected from the group of powders consisting of carbon, carbon black, graphite, graphene, and mixtures thereof;
- (b) 5-25 wt % of a non-fluorinated polyimide polymer with the structure I
- wherein X is O-Ph-C(CH3)2-Ph-O and Y is 1,3-bis(3-aminophenoxy) benzene (APB-133);
- (c) 0-1 wt % of a dispersant;
- and
- (d) 30-70 wt % of an organic solvent,
- wherein the wt % are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant and said cross-linking agent are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.
A polyimide-based polymer thick film paste composition for forming a polyimide-based polymer thick film resistor, the paste composition comprising:
- (a) 35-70 wt % of a functional component that is a mixture of
- i) a powder selected from the group of powders consisting of carbon, black, graphite, graphene, and mixtures thereof;
- and
- ii) an electrical conductive metal powder wherein said metal is selected from the group consisting of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni, an alloy of Ag, Cu, Au, Pd, Pt, Sn, Al, Ni and mixtures thereof, wherein said electrical conductive metal powder is 0.1-98 wt % of said functional component;
- (b) 5-25 wt % of a non-fluorinated polyimide polymer with the structure I
- wherein X is O-Ph-C(CF13)2-Ph-O and Y is -bis(3-aminophenoxy) benzene (APB-133);
- (c) 0-1 wt % of a dispersant;
- and
- (d) 30-70 wt % of an organic solvent,
- wherein the wt % of said functional component, said polyimide polymer, said dispersant, said cross-linking agent and said solvent are based on the total weight of said paste composition, said functional component is dispersed in and said polyimide polymer and said dispersant are dissolved in said organic solvent and the ratio of the weight of said polyimide polymer to the weight of said functional component is between 0.1 and 3.
Dependencies are inferred from the claim text.