Anisotropic conductive film and method for manufacturing anisotropic conductive film
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroyuki IGUCHI, Toshio SHIOBARA, Tsutomu KASHIWAGI
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Abstract
The present invention is an anisotropic conductive film including: a peelable substrate, a base layer containing an insulating resin on the peelable substrate, bumps of electroconductive nanoparticle assemblies disposed on the base layer at intervals of 1 μm to 100 μm, and a coating layer containing an insulating resin formed on the base layer so as to coat the bumps, wherein the peelable substrate is peelable to the base layer. This provides an anisotropic conductive film for connecting circuit electrodes having fine patterns.
Claims20
An anisotropic conductive film comprising:
- a peelable substrate,
- a base layer containing an insulating resin on the peelable substrate,
- bumps of electroconductive nanoparticle assemblies disposed on the base layer at intervals of 1 μm to 100 μm, and
- a coating layer containing an insulating resin formed on the base layer so as to coat the bumps,
- wherein the peelable substrate is peelable to the base layer.
A method for manufacturing an anisotropic conductive film, comprising the steps of:
- (1) performing coating of a composition containing an insulating resin onto a peelable substrate to form a base layer;
- (2) applying voltage to a dispersion of electroconductive nanoparticles to apply the dispersion of electroconductive nanoparticles onto the base layer through a nozzle by electrostatic force, whereby disposing bumps of electroconductive nanoparticle assemblies on the base layer at intervals of 1 μm to 100 μm;
- and
- (3) performing coating of a composition containing an insulating resin so as to coat surfaces of the bumps to form a coating layer on the base layer.
A method for manufacturing an anisotropic conductive film, comprising the steps of:
- (1) applying voltage to a dispersion of electroconductive nanoparticles to apply the dispersion of electroconductive nanoparticles onto a peelable substrate through a nozzle by electrostatic force, whereby disposing bumps having an average diameter of 1 μm or more and less than 100 μm on the peelable substrate at intervals of 1 μm or more and 100 μm or less;
- (2) performing coating of a composition containing an insulating resin so as to have a thickness of 10 μm or more and 100 μm or less to coat surfaces of the bumps, whereby forming an insulating resin layer;
- and
- (3) curing the insulating resin layer, followed by peeling the peelable substrate to obtain a film.
Dependencies are inferred from the claim text.