Resin composition and semiconductor device

Abstract

An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.

Dependencies are inferred from the claim text.