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US 2019/0100641 A1Published application
Fine silver particle dispersion
AssigneeDowa Electronics Materials Co., Ltd.
InventorsShingo TERAGAWA, Takashi HINOTSU, Dave HUI, Michael Stephen WOLFE, Howard David GLICKSMAN, Haixin YANG
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Abstract
This disclosure relates to a fine silver particle dispersion comprising: (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C., wherein the weight percentages are based on the weight of the fine silver particle dispersion.
Claims11
A fine silver particle dispersion comprising:
- (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm,
- (ii) 4.5 to 39 wt. % of a solvent;
- and
- (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300° C.,
- wherein the weight percentages are based on the weight of the fine silver particle dispersion.
2 more elements
Dependencies are inferred from the claim text.