High Modulus Curable Composition

Abstract

The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I) -An-R-SiXYZ  (I), wherein A is a divalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C1 to C8 alkyl, C1 to C8 alkoxy, and C1 to C8 acyloxy groups, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C1 to C8 alkoxy or C1 to C8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) wherein R′ is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, and Ar is selected from aryl groups, and adhesive, sealant, or coating materials comprising the composition and use thereof.

Dependencies are inferred from the claim text.