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US 2019/0100499 A1Published application
New metal plating compositions
AssigneesDow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
InventorsLingli DUAN, Chen CHEN, Shaoguang FENG, Zhkhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
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Abstract
Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
Claims8
1-6. (canceled)
A method comprising:
- a) contacting a substrate to be metal plated with a composition comprising:
- one or more sources of metal ions, an electrolyte and a reaction product of one or more reaction products of one or more diamines comprising primary or secondary amine moieties and one or more compounds having formula:
- where R is a linking group;
- b) contacting the substrate with the composition;
- c) applying a current to the substrate;
- and
- d) plating a metal on the substrate.
4 more elements
Dependencies are inferred from the claim text.