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US 2019/0099860 A1Published application
Polishing pad and polishing method
AssigneeIV Technologies CO., Ltd.
InventorYu-Piao Wang
Life of this patent
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Abstract
A polishing pad is provided. The polishing pad, suitable for polishing an object, includes a polishing layer and at least one groove. The polishing layer has a central region and a peripheral region surrounding the central region. The at least one groove is disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, wherein the two ends include an open end and a closed end.
Claims32
A polishing pad suitable for polishing an object, the polishing pad comprising:
- a polishing layer, having a central region and a peripheral region surrounding the central region;
- and
- at least one groove disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, and the two ends comprise an open end and a closed end, and wherein the at least one groove is extended through the central region.
A polishing pad suitable for polishing an object, the polishing pad comprising:
- a polishing layer, having a central region and a peripheral region surrounding the central region;
- at least one groove disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, and the at least one groove is extended through the central region;
- and
- a virtual extending straight line passing through a center of the polishing pad and perpendicular to a tangential direction of the at least one groove, wherein the at least one groove is not symmetric with respect to the virtual extending straight line.
1 more element
Dependencies are inferred from the claim text.