Cu-Ni-Sn Based Copper Alloy Foil, Copper Rolled Product, Electronic Device Parts and Autofocus Camera Module

Abstract

Provided is a thinner Cu—Ni—Sn based copper alloy foil that has a foil thickness of 0.1 mm or less, has improved solder wettability and improved solder adhesion strength, and can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules; a copper rolled product; an electronic device part; and an autofocus camera module. The Cu—Ni—Sn based copper alloy foil according to one embodiment of the present invention has a foil thickness of 0.1 mm or less; and contains from 14% by mass to 22% by mass of Ni, from 4% by mass to 10% by mass of Sn, the balance being copper and inevitable impurities; and has a maximum height roughness Rz of from 0.1 μm to 1 μm, on a surface in a direction parallel to a rolling direction.

Dependencies are inferred from the claim text.