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US 2019/0099840 A1Published application
Solder alloy and junction structure using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHIDETOSHI KITAURA, AKIO FURUSAWA, KIYOHIRO HINE
Life of this patent
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Abstract
A solder alloy, includes: about 3 wt % to about 15 wt % of Sb; about 0.01 wt % to about 1.5 wt % of Te; and about 0.005 wt % to about 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr; and a balance of Sn.
Claims7
A solder alloy, comprising:
- 3 wt % to 15 wt % of Sb;
- 0.01 wt % to 1.5 wt % of Te;
- and 0.005 wt % to 1 wt % of at least one element selected from the group consisting of Zn, Co, and Cr;
- and a balance of Sn.
1 more element
A junction structure, comprising:
- a semiconductor element including a first metal layer;
- a circuit substrate including a second metal layer;
- and
- a solder joint layer that joins the first metal layer in the semiconductor element and the second metal layer in the circuit substrate, wherein the solder joint layer at least comprises Sn, Sb and Te, and further comprises at least one element selected from the group consisting of Zn, Co and Cr, wherein an SnNi alloy or an SnCu alloy is present in a boundary face between the first metal layer and the solder joint layer, and in a boundary face between the second metal layer and the solder joint layer.
1 more element
Dependencies are inferred from the claim text.