Apparatus, system, and method for mitigating warpage of circuit boards during reflow processes
AssigneeJuniper Networks, Inc.
InventorsPeng Su, Gautam Ganguly, Marc D. Hartranft
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Abstract
The disclosed apparatus may include (1) a removable stiffening brace that (A) temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board and (B) provides structural support to the circuit board to prevent the circuit board from warping during the reflow process and (2) at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process. Various other apparatuses, systems, and methods are also disclosed.
Claims20
An apparatus comprising:
- a removable stiffening brace that:
- temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board;
- and
- provides structural support to the circuit board to prevent the circuit board from warping during the reflow process;
- and
- at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process.
A warpage-mitigation system comprising:
- a removable stiffening brace that:
- temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board;
- provides structural support to the circuit board to prevent the circuit board from warping during the reflow process;
- and
- includes at least one pin that is inserted through a hole formed in a circuit board;
- and
- at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process by locking the pin inserted through the hole to a top surface of the circuit board.
The warpage-mitigation system of claim 16, wherein the heatsink is attached to the die of the lidless integrated circuit by way of the hole formed in the circuit board.
A method comprising:
- temporarily interfacing a removable stiffening brace with a bottom surface of a circuit board prior to a reflow process in which at least one component is soldered to the circuit board;
- securing the removable stiffening brace to the bottom surface of the circuit board by way of at least one fastener;
- and
- providing, by way of the removable stiffening brace, structural support to the circuit board to prevent the circuit board from warping during the reflow process.
Dependencies are inferred from the claim text.