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US 2019/0099819 A1Published application
Soldering apparatus and method for creating program
AssigneeHakko Corporation
InventorsYoshitomo TERAOKA, Tomoo TAKAHARA
Life of this patent
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Abstract
The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.
Claims15
A soldering apparatus comprising:
- a soldering iron having an iron tip configured to melt solder;
- a driving portion configured to more the soldering iron;
- and
- an operation portion configured to be displaced for instructing the driving portion of a moving direction of the soldering iron,
- wherein the driving portion moves the soldering iron in a direction in correspondence to a displacement direction of the operation portion during an operation on the operation portion.
2 more elements
A soldering apparatus comprising:
- a soldering iron having an iron tip configured to melt solder;
- a driving portion configured to move the soldering iron;
- and
- an operation portion to be operated for instructing the driving portion of a moving direction of the soldering iron,
- wherein the operation portion allows an operator operating the operation portion to perceive an operation direction of the operation portion through a tactile sense of the operator, and
- wherein the driving portion moves the soldering iron in a direction in correspondence to the operation direction of the operation portion during an operation on the operation portion.
3 more elements
Dependencies are inferred from the claim text.