Soldering apparatus

A soldering apparatus comprising:

• a soldering iron configured to perform soldering on a surface of an electronic board having soldering regions, the soldering regions including a base region and at least one replication region, the base region having at least one soldering position in an arrangement pattern, each replication region including an arrangement pattern that is the same as the arrangement pattern of the at least one soldering position in the base region;
• a driving portion configured to move the soldering iron;
• an input portion configured to receive, for each replication region, input of positional relationship data representing a positional relationship between the base region and the replication region, and configured to receive base pattern data representing the arrangement pattern of the at least one soldering position in the base region;
• and
• a controller configured to control the driving portion based on the base pattern data and the positional relationship data,
• wherein the controller
• (i) determines a base region movement pattern based on the base pattern data,
• (ii) controls the driving portion such that the soldering iron moves, according to the determined base region movement pattern, to the at least one soldering position of the base region, and
• (iii) controls the driving portion such that the soldering iron is moved in each replication region based on the respective positional relationship data and the determined base region movement pattern.