Heat exchange module, system and method

An enclosure assembly, comprising:

• a flexible inner sheet having a hole;
• a thermally-conductive plate piece whose perimeter is secured to the inner sheet and which is positioned at and covering the hole;
• and
• a flexible outer sheet attached to the inner sheet via RF or ultrasonic welding or thermal compression to form a channel therebetween for liquid flow between the inner and outer sheets with an exposed surface of the plate piece forming a portion of a wall of the channel so as to be in direct contact with liquid when present and flowing through the channel for heat transfer between the plate piece and the flowing liquid.

An enclosure assembly, comprising:

• a flexible inner sheet having a hole;
• a thermoelectric cooler (TEC) assembly which includes a TEC whose reference side is at and covering the hole;
• and
• a flexible outer sheet attached to the inner sheet via RF or ultrasonic welding or thermal compression to form a channel therebetween for liquid flow between the inner and outer sheets with the reference side forming a portion of a wall of the channel so as to be in direct contact with liquid when present and flowing through the channel for direct heat transfer between the TEC and the flowing liquid.

A heat exchange module, comprising:

• an enclosure assembly which includes:
• a flexible first sheet having a first hole;
• a flexible second sheet having a second hole aligned with the first hole;
• a thermally-conductive plate piece embedded in and between the first and second sheets at the first and second holes and covering at least the second hole;
• and a flexible third sheet attached to the second sheet so as to form a channel for liquid between the second and third sheets with an exposed surface of the plate piece forming a portion of a wall of the channel so as to be in direct contact with liquid when present and flowing through the channel for heat transfer between the plate piece and the liquid;
• a plate assembly which includes the plate piece;
• a thermoelectric cooler (TEC) assembly which includes a TEC whose reference side is in heat transfer relation with the plate piece;
• and
• a heat distribution cover assembly in heat transfer relation with a user side of the TEC.

A heat exchange module, comprising:

• a channel enclosure including a channel for heat-transfer liquid and a thermally-conductive plate assembly which includes thermally-conductive first and second plate pieces for heat transfer with the liquid when present and flowing in the channel;
• a thermoelectric cooler (TEC) assembly which includes a first TEC whose reference side is in heat transfer relation with the first plate piece and a second TEC whose reference side is in heat transfer relation with the second plate piece;
• a heat distribution cover assembly which is in heat transfer relation with user sides of the first and second TECs;
• the cover assembly including a plate having a plurality of module-flexibility weakened areas;
• the cover assembly having an inner-surface plastic layer on the plate.

A heat exchange module, comprising:

• a channel enclosure including a channel for heat-transfer liquid and a thermally-conductive plate assembly which includes thermally-conductive first and second plate pieces configured for heat transfer with the liquid when present and flowing in the channel;
• a thermoelectric cooler (TEC) assembly which includes a first TEC whose reference side is in heat transfer relation with the first plate piece and a second TEC whose reference side is in heat transfer relation with the second plate piece;
• a heat transfer assembly having a plate assembly which is in heat transfer relation with user sides of the first and second TECs;
• a heat transfer substance between (a) the reference sides of the first and second TECs and the first and second plate pieces, respectively, and/or (b) the user sides of the first and second TECs and the plate assembly;
• the heat transfer substance not rigidly affixing the TECs and allowing for relative lateral movement;
• and
• the cover assembly and the channel enclosure being attached together in a manner so as to not block all of the relative movement.

A method of assembling a heat exchange module, comprising:

• forming an enclosure assembly including a channel for a heat-transfer liquid and a plate assembly;
• the plate assembly including a plate piece having a first face forming a portion of a wall of the channel and in direct contact with the liquid when present and flowing in the channel and an opposite exposed second face;
• applying a thermally-conductive first substance between the second face and a reference face of a thermoelectric cooler (TEC) of a TEC assembly;
• applying a thermally-conductive second substance between an opposite user face of the TEC and a heat transfer assembly;
• and
• attaching the heat transfer assembly and the enclosure assembly together.

A method of assembling a heat exchange module, comprising:

• forming an enclosure assembly including a channel for a heat-transfer liquid and a plate assembly;
• the plate assembly including a plate piece having a first face forming a portion of a wall of the channel and in direct contact with the liquid when present and flowing in the channel and an opposite exposed second face;
• connecting the second face and a reference face of a thermoelectric cooler (TEC) of a TEC assembly together in heat conductive relation;
• connecting an opposite user face of the TEC and a heat distribution cover assembly together in heat conductive relation;
• the cover assembly including a flexible heat distribution plate and a plastic layer on an inward face of the plate with a thermistor or thermocouple disposed between the plate and the layer;
• and
• attaching the cover assembly and the enclosure assembly together.

A method of assembling a heat exchange module, comprising:

• forming an enclosure assembly including a channel for a heat-transfer liquid and a plate assembly;
• the plate assembly including a plate piece having a first face forming a portion of a wall of the channel and thereby in direct contact with the liquid when present and flowing in the channel and an opposite exposed second face;
• connecting the second face and a reference face of a thermoelectric cooler (TEC) of a TEC assembly together in heat conductive relation;
• connecting an opposite user face of the TEC and a heat distribution cover assembly together in heat conductive relation;
• at least one of the connecting steps including a core composite layer disposed between the cover assembly and the enclosure assembly, the layer having a preformed opening in which the TEC is positioned;
• and
• attaching the cover assembly and the enclosure assembly together.

A heat exchange module, comprising:

• a channel enclosure including a channel for heat-transfer liquid and a thermally-conductive plate assembly which includes thermally-conductive first and second plate pieces for heat transfer with the liquid when present and flowing in the channel;
• a thermoelectric cooler (TEC) assembly which includes a first TEC whose reference side is in heat transfer relation with the first plate piece and a second TEC whose reference side is in heat transfer relation with the second plate piece;
• a heat distribution cover assembly which includes a tray assembly, a plurality of tiles and a frame which holds the tray assembly and the plurality of tiles together;
• the tray assembly including a first tray having a first opening through which a user side of the first TEC is accessible and a second tray having a second opening through which a user side of the second TEC is accessible;
• and
• the plurality of tiles including a thermally-conductive first tile which is in heat transfer relation with the user side of the first TEC and a thermally-conductive second tile which is in heat transfer relation with the user side of the second TEC.

A heat exchange module, comprising:

• a channel enclosure including a channel for heat-transfer liquid and a thermally-conductive plate assembly which includes thermally-conductive first and second plate pieces for heat transfer with the liquid when present and flowing in the channel;
• a thermoelectric cooler (TEC) assembly which includes a first TEC whose reference side is in heat transfer relation with the first plate piece and a second TEC whose reference side is in heat transfer relation with the second plate piece;
• a heat distribution cover assembly which includes plurality of thermally-conductive tiles and a flexible plastic frame which snap-fit or hook-fit holds the plurality of tiles together;
• and
• the plurality of tiles including a thermally-conductive first tile which is in heat transfer relation with the user side of the first TEC and a thermally-conductive second tile which is in heat transfer relation with the user side of the second TEC.

A heat transfer assembly, comprising:

• a thermoelectric cooler (TEC) assembly which includes a first TEC whose reference side is configured to be positionable in heat transfer relation with a flow of heat transfer liquid and a second TEC whose reference side is configured to be positionable in heat transfer relation with the flow of the heat transfer liquid;
• a heat distribution cover assembly which includes a tray assembly, a plurality of heat-conductive tiles and a frame which holds the tray assembly and the plurality of tiles together;
• the tray assembly including a first tray having a first opening through which a user side of the first TEC passes and a second tray having a second opening through which a user side of the second TEC passes;
• and
• the plurality of tiles including a thermally-conductive first tile which is in heat transfer relation with the user side of the first TEC and a thermally-conductive second tile which is in heat transfer relation with the user side of the second TEC.

A method comprising:

• positioning a heat distribution cover assembly of a heat exchange module against a body part of a patient;
• the module further including:
• a channel for a heat transfer liquid;
• a thermally-conductive plate piece;
• a thermoelectric cooler (TEC) assembly which includes a TEC having a reference side and a user side which is positioned in heat transfer relation with the cover assembly;
• a wall of the channel including the plate piece which is thereby in direct contact with the liquid on one side thereof and with the TEC reference side on an opposite side thereof;
• the module including at least one thermistor or thermocouple adjacent a thermally-conductive plate assembly of the cover assembly to measure a temperature of the adjacent body part;
• circulating a heat transfer liquid through the channel;
• and
• controlling the TEC assembly using temperature signal(s) from the at least one thermistor or thermocouple so as to maintain a surface of the body part at a desired temperature by transferring heat to and/or from the body part and the heat transfer liquid in the channel through the cover assembly.

A heat exchange module, comprising:

• a channel assembly including a channel, an inlet and an outlet;
• a heat exchange stack attached to the channel assembly;
• the heat exchange stack including one or more thermoelectric coolers (TECs);
• and
• the heat exchange stack including a thermally-conductive plate construction configured to provide flexibility for the channel assembly and thereby for the heat exchange module.

A heat exchange module, comprising:

• a channel assembly including a channel, an inlet and an outlet;
• a heat exchange stack attached to the channel assembly;
• the channel including window openings;
• the heat exchange stack including a thermally-conductive plate piece covering the window openings and sealed to the channel assembly;
• and
• the heat exchange stack including one or more thermoelectric coolers positioned against the thermally-conductive plate piece.

A heat exchange module, comprising:

• a channel assembly including a fluid channel, an inlet and an outlet;
• a heat exchange stack attached to the channel assembly;
• and
• the heat exchange stack including first and second spaced plates, one or more thermoelectric coolers between the plates and a core composite layer between the plates and holding them in spaced relation.

A heat exchange module, comprising:

• a channel assembly including a channel, an inlet and an outlet;
• a heat exchange stack attached to the channel assembly;
• and
• the heat exchange stack including first and second spaced plates, one or more thermoelectric coolers between the plates, spacer material between the plates and mechanical securement extending between the plates and holding them together.

A heat exchange module, comprising:

• a channel assembly including a channel, an inlet and an outlet;
• a heat exchange stack attached to the channel assembly;
• and
• the heat exchange stack including first and second spaced plates, one or more thermoelectric coolers between the plates and a layer of heat reflective material between the plates.