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US 2019/0098802 A1Published application
Shielding in electronic assemblies
AssigneeIntel Corporation
InventorsScott Mokler, Timothy Swettlen, Kevin Byrd
Life of this patent
Estimating the term…
Abstract
Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.
Claims26
An electronic assembly, comprising:
- a circuit board having a hole extending therethrough, wherein the circuit board has a first face and a second face opposite to the first face;
- and
- a shield coupled to the second face of the circuit board by solder in contact with the shield and the second face of the circuit board, wherein the shield extends into the hole towards the first face.
An electronic assembly, comprising:
- a circuit board having a hole extending therethrough, wherein the circuit board has a first face and a second face opposite to the first face;
- and
- a shield coupled to the second face of the circuit board, wherein the shield includes a cavity and the cavity is at least partially In the hole, and the shield is coupled to a conductive contact on the second face of the circuit board with solder paste.
(canceled)
A method of manufacturing an electronic assembly, comprising:
- bringing a shield into contact with solder material on a circuit board, wherein the circuit board has a hole extending therethrough, and the shield has a cavity that, when the shield is brought into contact with the circuit board, extends into the hole;
- and
- reflowing the solder material to secure the shield to the circuit board.
A computing device, comprising:
- a circuit board having a hole extending therethrough, wherein the circuit board has a first face and a second face opposite to the first face;
- a shield coupled to the second face of the circuit board by a conductive material in contact with the shield and the second face of the circuit board, wherein the shield includes a cavity and the cavity is at least partially in the hole;
- and
- an integrated circuit (IC) package coupled to the second face of the circuit board, wherein the IC package includes a package substrate and an electronic component coupled to the package substrate, and the electronic component extends into the cavity.
1 more element
Dependencies are inferred from the claim text.