Thermal enclosure

An enclosure for convection cooling an electronic module in a motor vehicle, the enclosure comprising:

• a cold plate for mounting the electronic module thereon, a thermal conduit being disposed in the cold plate and extending from a thermal inlet to a thermal outlet;
• a cover attached to the cold plate, wherein the cover and the cold plate define a cavity;
• a plurality of inlets formed in the cover in fluid communication with the cavity;
• a plurality of outlets formed in the cover in fluid communication with the cavity, the outlets spaced apart from and opposite the inlets;
• an inlet manifold disposed in fluid communication with the plurality of inlets;
• a plurality of fans disposed in fluid communication with the cavity, each of the plurality of fans having an inlet side in fluid communication with an outlet side;
• wherein the thermal inlet is adjacent the outlets in the cover, and the thermal outlet is adjacent the inlets in the cover, and wherein air enters the cavity through the inlets in the cover via the inlet manifold, and air exits the cavity through the outlets in the cover.

An enclosure for convection cooling an electronic module in a motor vehicle, the enclosure comprising:

• an inlet plate having a plurality of inlets, an electromagnetic compatibility (EMC) material covering each of the plurality of inlets;
• an outlet plate spaced apart from the inlet plate, the outlet plate having a plurality of outlets sized to minimized radiated electromagnetic emissions;
• a first side plate connected at an angle to the inlet plate and the outlet plate, the first side plate extending from the inlet plate to the outlet plate, the first side plate connected at an angle to a top plate and connected at an angle to a bottom plate, a second side plate spaced apart from the first side plate and connected at an angle to the inlet plate and the outlet plate, the second side plate connected at an angle to the top plate and connected at an angle to the bottom plate;
• each of the first side plate, the second side plate, the top plate, the bottom plate, the inlet plate, and the outlet plate being electrically bonded to a dielectrically conductive EMC gasket material;
• an inlet manifold disposed in fluid communication with the plurality of inlets of the inlet plate;
• a plurality of fans convection cooling the thermal enclosure and disposed in fluid communication with the thermal enclosure, each of the plurality of fans having an inlet side and an outlet side in fluid communication with the inlet side, the inlet side of each of the plurality of fans connected to the inlet manifold, and the outlet side of each of the plurality of fans disposed proximate to the inlet plate at a distance optimized to minimize a pressure differential between the plurality of fans and the thermal enclosure, and wherein the outlet side of each of the plurality of fans is in fluid communication with one of the plurality of inlets in the inlet plate and the inlet side of each of the plurality of fans is in fluid communication with the inlet manifold,
• wherein at least one of the top plate and the bottom plate is a liquid cooled high thermal conductivity cold plate, a thermal conduit being disposed in the cold plate and extending from a thermal inlet to a thermal outlet, wherein the thermal inlet is adjacent the outlets in the outlet plate, and wherein the thermal outlet is adjacent the inlets in the inlet plate, and wherein the electronic module is mounted directly to the cold plate.