Formed enclosure part and electronic subassembly
AssigneeEllenberger & Poensgen GmbH
InventorMANUEL ENGEWALD
Life of this patent
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Abstract
A formed enclosure part for mounting an electronic component on a printed circuit board includes a receiving side having an enclosure opening for receiving the electronic component in an enclosure interior, a connection side adjoining the receiving side and having connection leadthroughs for electrical connections of the electronic component, and a mounting side having a formed-on mounting profile for positioning the formed enclosure part and holding the formed enclosure part on the printed circuit board without the use of tools. An electronic subassembly, which is also provided, receives a printed circuit board and the formed enclosure part having an electronic component disposed therein.
Claims12
A formed enclosure part for mounting an electronic component on a printed circuit board, the formed enclosure part comprising:
- an enclosure interior;
- a receiving side having an enclosure opening for receiving the electronic component in said enclosure interior;
- a connection side adjoining said receiving side and having connection leadthroughs for electrical connections of the electronic component;
- and
- a mounting side having a formed-on mounting profile for positioning and holding the formed enclosure part on the printed circuit board without using of tools.
Dependencies are inferred from the claim text.