Package sealing structure, device package, and package sealing method
AssigneeJapan Aviation Electronics Industry, Limited
InventorYasuhiro CHIDA
Life of this patent
Estimating the term…
Abstract
A package sealing structure is provided wherein a narrow neck of a through-hole formed in a package member is closed with substance that has been produced from melting of an outer side of the package member and then has solidified, and the narrow neck is narrower than an opening of the thorough-hole that has been enlarged by the melting.
Claims10
A package sealing structure, wherein a narrow neck of a through-hole formed in a package member is closed with a substance that has been produced from melting of an outer side of the package member and then has solidified, and the narrow neck is narrower than an opening of the through-hole that has been enlarged by the melting.
A package sealing structure comprising a structure resulting from cooling, in a through-hole which had been formed in an enclosure part of a package and had had a hole diameter not uniform in a through direction of the thorough-hole, melt that had been produced from melting of a portion located on a periphery of an outer side opening of the through-hole and had formed a lump without holes in the process of moving down along an inner wall of the through-hole.
A package sealing method comprising:
- forming, in an enclosure part of a package, a through-hole having a hole diameter not uniform in a through direction of the thorough-hole;
- melting a portion located on a periphery of an outer side opening of the through-hole;
- and
- cooling, in the through-hole, melt that has produced in the melting of the portion and has formed a lump without holes in the process of moving down along an inner wall of the through-hole.
Dependencies are inferred from the claim text.