Etching for bonding polymer material to a metal surface
AssigneeApple Inc.
InventorsTodd S. MINTZ, Shi Hua ZHANG, Abhijeet MISRA, Eric W. HAMANN
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AssigneeApple Inc.
InventorsTodd S. MINTZ, Shi Hua ZHANG, Abhijeet MISRA, Eric W. HAMANN
Estimating the term…
This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.
A composite part, comprising:
A multi-piece enclosure for an electronic device, comprising:
A method for forming multiple interlocking structures at an external surface of a part that includes a metal substrate overlaid by a primary metal oxide layer, the method comprising:
Dependencies are inferred from the claim text.