Back to results
US 2019/0098771 A1Published application
Double-sided and multilayered printed circuit board fabrication using inkjet printing
AssigneeNano Dimension Technologies, Ltd.
InventorsSharon Fima, Hila Elimelech
Life of this patent
Estimating the term…
Abstract
The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.
Claims20
An inkjet printing method for forming a double-sided printed circuit board (PCB) comprising:
- a. providing a peelable substrate;
- b. providing an ink jet printing system comprising:
- i. a first print head having:
- at least one aperture, a first ink reservoir, and a first pump configured to supply the first inkjet ink through the aperture;
- ii. a second print head having:
- at least one aperture, a second ink reservoir, and a second pump configured to supply the second inkjet ink through the aperture;
- and
- iii. a conveyor, operably coupled to the first print head and to the second print head, configured to convey the peelable substrate to the first and second print head;
- c. providing a first inkjet conductive ink composition;
- d. using the first inkjet ink, forming a first circuit pattern on the removable substrate;
- curing the first circuit pattern;
- providing a second inkjet ink composition configured to form a reinforced thermoset, insulating board;
- e. using the second inkjet ink, forming an insulating portion on the removable substrate on all exposed areas of the removable substrate not occupied by the first circuit pattern;
- curing the second inkjet ink;
- and
- f. removing the peelable substrate, wherein the first circuit pattern and the thermoset reinforced board form a substantially planar surface.
13 more elements
An inkjet printing method for forming a single sided printed circuit board (PCB) comprising:
- a. providing a peelable substrate;
- b. providing an ink jet printing system comprising:
- i. a first print head having:
- at least one aperture, a first ink reservoir, and a first pump configured to supply the first inkjet ink through the aperture;
- ii. a second print head having:
- at least one aperture, a second ink reservoir, and a second pump configured to supply the second inkjet ink through the aperture;
- and
- iii. a conveyor, operably coupled to the first print head and to the second print head, configured to convey the removable substrate to the first and second print head c. providing a first inkjet conductive ink composition;
- d. using the second inkjet ink, forming an insulating layer on the peelable substrate;
- e. using the first inkjet ink, forming a first circuit pattern on the insulating layer;
- f. curing the first circuit pattern;
- g. providing a second inkjet ink insulating composition;
- h. using the second inkjet ink, forming an insulating portion on the insulating layer on all exposed areas of the insulating layer not occupied by the first circuit pattern;
- i. curing the second inkjet ink;
- and
- j. removing the peelable substrate, wherein the first circuit pattern and the insulating portions form a substantially planar surface
13 more elements
Dependencies are inferred from the claim text.