Wiring substrate for electronic component inspection apparatus

A wiring substrate for electronic component inspection apparatus comprising a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate,

• the wiring substrate for electronic component inspection apparatus being characterized in that
• each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion or a nut tube portion which perpendicularly extends from a center portion of an outside surface of the flange portion;
• and
• the flange portion has a truncated conical shape and the outside surface from which the bolt portion or the nut tube portion protrudes, such that the outside surface slopes from a proximal end side of the bolt portion or a proximal end side of the nut tube portion toward a peripheral edge of the flange portion and gradually approaches an inside surface of the flange portion.