Fine feature formation techniques for printed circuit boards
AssigneeIntel Corporation
InventorsERIC LI, Kemal Aygun, Kai Xiao, Gong Ouyang, Zhichao Zhang
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Abstract
Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure 306 on a low density interconnect (LDI) printed circuit board (PCB) 150 according to an LDI fabrication process and forming one or more fme conductive features on the LDI PCB by performing a fme feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fme gap region 308 within the conductive structure. Other embodiments are described and claimed.
Claims26
-25. (canceled)
A method, comprising:
- fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process;
- and
- forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure.
The method of claim 5, the connection array to comprise an inter-element pitch of approximately 0.8 mm.
A method, comprising:
- fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process;
- and
- performing a laser ablation process to use one or more portions of conductive material of the conductive structure to form one or more fine conductive features, the laser ablation process to comprise steering a laser beam to cause the laser beam to ablate conductive material from the conductive structure to create a fine gap region within the conductive structure.
A method, comprising:
- fabricating a conductive structure on a low density interconnect (LDI) printed circuit board (PCB) according to an LDI fabrication process;
- and
- forming two or more conductive traces from conductive material of the conductive structure by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region within the conductive structure.
Dependencies are inferred from the claim text.