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US 2019/0098762 A1Published application
Area-efficient connections to sip modules
AssigneeApple Inc.
InventorsLan H. Hoang, Takayoshi Katahira
Life of this patent
Estimating the term…
Abstract
Connectors that allow system-in-package modules to connect to other circuits in an electronic device in an area-efficient manner.
Claims20
An electronic device comprising:
- a system-in-package module comprising:
- a top printed circuit board;
- a first component and a first plurality of contacts on a surface of the top printed circuit board;
- a bottom printed circuit board;
- a second component and a second plurality of contacts on a surface of the bottom printed circuit board, where the surface of the top printed circuit board and the surface of the bottom printed circuit board face each other such that the first component and the second component are between the top printed circuit board and the bottom printed circuit board;
- and
- a frame attached to the surface of the top printed circuit board and the surface of the bottom printed circuit board, the frame having an outside surface forming an outside surface of the system-in-package module, the frame having a first contact, the frame providing route paths for signals and power from the first component to the second component;
- and
- a flexible circuit board having a contact electrically connected to the first contact on the frame.
6 more elements
A system-in-package module comprising:
- a top printed circuit board;
- a first component and a first plurality of contacts on a surface of the top printed circuit board;
- a bottom printed circuit board;
- a second component and a second plurality of contacts on a surface of the bottom printed circuit board, where the surface of the top printed circuit board and the surface of the bottom printed circuit board face each other such that the first component and the second component are between the top printed circuit board and the bottom printed circuit board;
- and
- a frame attached to the surface of the top printed circuit board and the surface of the bottom printed circuit board, the frame comprising:
- a third plurality of contacts in an outside surface of the frame;
- and
- a first trace along the outside surface of the frame to connect one of the third plurality of contacts with one of the first plurality of contacts.
6 more elements
A system-in-package module comprising:
- a top printed circuit board;
- a first component and a first plurality of contacts on a surface of the top printed circuit board;
- a bottom printed circuit board;
- a second component and a second plurality of contacts on a surface of the bottom printed circuit board, where the surface of the top printed circuit board and the surface of the bottom printed circuit board face each other such that the first component and the second component are between the top printed circuit board and the bottom printed circuit board;
- a flexible circuit board located partially in an area between the top printed circuit board and the bottom printed circuit board, the flexible circuit board partially located beyond the area between the top printed circuit board and the bottom printed circuit board and comprising a third plurality of contacts;
- and
- a frame between the top printed circuit board and the bottom printed circuit board and having a fourth plurality of contacts electrically connected to the second plurality of contacts on the bottom printed circuit board, and further having a fifth plurality of contacts electrically connected to the third plurality of contacts on the flexible circuit board.
4 more elements
Dependencies are inferred from the claim text.