Exothermic reaction electrode structure using pcb and semiconductor fabrication methods

A method for fabricating PCB-type exothermic reaction electrode structure, comprising:

• providing a core dielectric or semiconductor substrate;
• forming a first electrode as a pattern of a first electrode material comprising nickel or palladium or an alloy of nickel and palladium, the first electrode formed on a first dielectric or semiconductor substrate surface;
• and
• forming a second electrode as a pattern of a second electrode material formed on a second dielectric or semiconductor substrate surface,
• wherein the first pattern and the second pattern are relatively spaced and orientated so as to create a pre-determined magnetic field when the first and second electrodes are connected a power supply.

An exothermic reaction chamber, comprising:

• an anode connected to a first power supply terminal;
• a cathode connected to a second power supply terminal;
• wherein at least one of the anode and cathode comprises a first electrically conductive trace on a dielectric or semiconductor substrate;
• and
• a housing comprising the anode, cathode, and optionally an interstitial fluid;
• whereby one of a current between the anode and cathode, and a magnetic field generated by the anode, the cathode, or both, is operative to trigger or control an exothermic reaction in the exothermic reaction chamber.